Surface and Edge Quality Variation in Micro-machining of OFHC copper
Author(s): Sangkee Min, Daeeun Lee, David A. Dornfeld A., and Nakkyu Lee
Publication: The 1st International Workshop on Next Generation Micro-Factory System Technology
Citation: The 1st International Workshop on Next Generation Micro-Factory System Technology, Seogwipo KAL Hotel, Jeju, Korea, July 15-16, 2005.
The surface and edge quality of single crystal and polycrystalline copper workpiece has been observed to vary significantly as a function of crystallographic orientation. At the precision scale, the chip formation process is influenced by the microstructure of the material, such as grain boundaries and grain orientation in polycrystalline materials, and crystallographic orientation in single-crystal materials. Such variation in the microstructure has a significant effect on the resulting surface, edge, and burr topography.